Genetic Algorithm Based Optimized Circuit Elements Placement In VLSI Design
By: Surana, Priya
.
Contributor(s): Kumar, Rakesh.
Publisher: New Delhi Journals Pub 2019Edition: Vol.5(2), Jul-Dec.Description: 22-31p.Subject(s): EXTC EngineeringOnline resources: Click here
In:
International journal of VLSI design and technologySummary: The optimization of printed circuit board and placing the electronic components with effectively is a challenging task. However, this dissertation report presents minimization of wire-length and failure rates of the board arising irregular local heat accumulation. By understanding the literature related to the problem in this dissertation two approaches are proposed and developed using genetic algorithms. First approach is for optimizing the placement of electronic components. The proposed genetic algorithm based electronic component placement approach is implemented in python. Second approach uses two criteria to place components: power dissipation (the heat dissipation of the elements should not damage nearby elements) and the total length of interconnections (should be as small as possible). The second approach is implemented using Unity and C# script.
| Item type | Current location | Call number | Status | Date due | Barcode | Item holds |
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Articles Abstract Database
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School of Engineering & Technology Archieval Section | Not for loan | 2020-2021183 |
The optimization of printed circuit board and placing the electronic components with effectively is a challenging task. However, this dissertation report presents minimization of wire-length and failure rates of the board arising irregular local heat accumulation. By understanding the literature related to the problem in this dissertation two approaches are proposed and developed using genetic algorithms. First approach is for optimizing the placement of electronic components. The proposed genetic algorithm based electronic component placement approach is implemented in python. Second approach uses two criteria to place components: power dissipation (the heat dissipation of the elements should not damage nearby elements) and the total length of interconnections (should be as small as possible). The second approach is implemented using Unity and C# script.
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